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CY8C3245AXI-166 | Cypress Semiconductor

CY8C3245AXI-166

Status: In Production

Datasheet

(pdf, 11.58 MB) RoHS PB Free
Datasheet updated: July 11, 2016
(zip, 532.78 KB) RoHS PB Free
Datasheet updated: July 11, 2016
(zip, 443.27 KB) RoHS PB Free
Datasheet updated: July 11, 2016

CY8C3245AXI-166

Development KitCY8CKIT-001
Boost Converter (Volts)0.5
CPU Core8051
CapSenseY
Dedicated ADC (#_ Max Resolution @ Sample Rate)DelSig (1, 12-bit @ 192 ksps)
Dedicated DAC (#_ Max Resolution @ Sample Rate)(1, 8-bit @ 8 msps)
EEPROM (KB)1
Flash (KB)32
LCD Direct Drive (Yes/No)Y
Max. Operating Frequency (MHz)50
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CAN Controllers0
No. of DMA Channels24
No. of Dedicated Comparators2
No. of Dedicated Digital Filter Blocks0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated Timer/Counter/PWM Blocks4
No. of Dedicated UART0
No. of GPIOs62
No. of Programmable Analog Blocks0
No. of Programmable Universal Digital Blocks20
No. of SIO8
No. of USB IO2
SRAM (KB)4
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.82 $4.62 $4.41 $4.21 $4.01 $3.67
Availability Quantity Ships In Order Now
In Stock 51 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
28
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

Last Update: Jul 05, 2012
Last Update: Jul 03, 2012

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (6)

Feb 08, 2016
Qualification of Manufacturing and Design Changes for PSoC 3 Products
Feb 08, 2016
Addendum to PCN 135245: Qualification of Manufacturing and Design Changes for PSoC 3 Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Nov 02, 2015
Qualification of Manufacturing and Design Changes for PSoC 3 Products
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (6)

Feb 05, 2016
Datasheet changes-PSoC 3 Products
Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
PSoC Programmer Upgrade for PSoC 3 Family of Products

Boundary Scan BSDL (2)