CY8C29866-24AXI | Cypress Semiconductor

CY8C29866-24AXI
Status: In Production

Datasheet

(pdf, 991.56 KB) RoHS PB Free
(pdf, 1.79 MB) RoHS PB Free
(pdf, 1.89 MB) RoHS PB Free

CY8C29866-24AXI

Development KitCY3215-DK, CY3211-100TQFP
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)32
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI4
No. of Dedicated UART4
No. of GPIOs64
No. of Programmable Analog Blocks12
No. of Programmable Digital Blocks16
SRAM (KB)2
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.15 $5.89 $5.63 $5.38 $5.12 $4.69
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 510 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
450
Minimum Order Quantity (MOQ)
450
Order Increment
450
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

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Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (59)

Development Kits/Boards (8)

Software and Drivers (2)

Product Change Notice (PCN) (15)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

User Module Datasheets (67)

Programming Specifications (1)

IBIS (1)

Mar 15, 2012