CY8C29466-24PXI | Cypress Semiconductor

CY8C29466-24PXI

Status: Obsolete

CY8C29466-24PXI

Development KitCY3215-DK, CY3211-28PDIP
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)32
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI4
No. of Dedicated UART4
No. of GPIOs24
No. of Programmable Analog Blocks12
No. of Programmable Digital Blocks16
SRAM (KB)2
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.01 $5.75 $5.50 $5.25 $5.00 $4.58
Availability Quantity Ships In Order Now
Out of Stock 177 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
1 398 L x 0 H x 300 W (Mils)
Package Weight
2 409.64 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
150
Minimum Order Quantity (MOQ)
150
Order Increment
150
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (8)

Software and Drivers (2)

Product Change Notice (PCN) (11)

Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) for SONOS4 Process, PSoC CY8C29xxx Device Family
Feb 10, 2016
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Qualification of Grace Semiconductor (GSMC) for PSoC CY8C29xxx Product Family
Feb 08, 2016
Material Change from Matte Sn to NiPdAu Leadframe Technology for Pb-Free Packages
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

User Module Datasheets (65)

Programming Specifications (1)

Reference Designs (1)

IBIS (1)

Mar 15, 2012

Technical Articles (1)