CY8C28623-24LTXI | Cypress Semiconductor

CY8C28623-24LTXI
Status: NRND: Contact Sales

Datasheet

(pdf, 3.13 MB) RoHS PB Free
(pdf, 1.29 MB) RoHS PB Free
(pdf, 1.39 MB) RoHS PB Free

CY8C28623-24LTXI

Development KitCY3215-DK, CY3207-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveY
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C2
No. of Dedicated OpAmps0
No. of Dedicated SPI3
No. of Dedicated UART3
No. of GPIOs44
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks12
SRAM (KB)1
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.60 $3.45 $3.30 $3.15 $3.00 $2.75
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
48
Package Dimensions
276 L x 276 H x 35 W (Mils)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (42)

Development Kits/Boards (2)

Product Change Notice (PCN) (4)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

Product Termination Notice (PTN) (1)

Sep 19, 2017

IBIS (1)

Jun 08, 2012