CY8C28433-24PVXI | Cypress Semiconductor

CY8C28433-24PVXI
Status: In Production

Datasheet

(pdf, 3.13 MB) RoHS PB Free
(pdf, 1.29 MB) RoHS PB Free
(pdf, 1.39 MB) RoHS PB Free

CY8C28433-24PVXI

Development KitCY3215-DK, CY3207-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Dedicated ADC (No._ Max. Resolution @ Sample Rate)SAR (1, 10-bit @ 192 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveY
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI3
No. of Dedicated UART3
No. of GPIOs24
No. of Programmable Analog Blocks10
No. of Programmable Digital Blocks12
SRAM (KB)1
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.13 $3.00 $2.87 $2.74 $2.61 $2.39
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 60 24-48 hours

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
94
Minimum Order Quantity (MOQ)
94
Order Increment
94
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (42)

Development Kits/Boards (2)

Product Change Notice (PCN) (5)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

IBIS (1)

Jun 08, 2012