CY8C27143-24PXI | Cypress Semiconductor

CY8C27143-24PXI

Status: In Production

CY8C27143-24PXI

Development KitCY3215-DK, CY3207-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI2
No. of Dedicated UART2
No. of GPIOs6
No. of Programmable Analog Blocks12
No. of Programmable Digital Blocks8
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.46 $3.32 $3.17 $3.03 $2.88 $2.64
Availability Quantity Ships In Order Now
In Stock 208 24-48 hours

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
385 L x 0 H x 300 W (Mils)
Package Weight
502.77 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
265
Minimum Order Quantity (MOQ)
265
Order Increment
265
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Development Kits/Boards (10)

Software and Drivers (2)

Product Change Notice (PCN) (14)

Feb 10, 2016
Qualification of Grace Semiconductor as an Additional Wafer Foundry Site for
Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
Feb 10, 2016
This is a correction to the Method of Identification section in the just released PCN#071421. Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology, PSoC CY8C27x Device Family
Feb 10, 2016
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C27X43 Device Family.
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Material Change from Matte Sn to NiPdAu Leadframe Technology for Pb-Free Packages
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Closure of Omedata Electronics and Qualification of Alternate Assembly Sites for Affected Parts

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

User Module Datasheets (64)

Programming Specifications (1)

Reference Designs (1)

IBIS (1)

Jun 08, 2012

Technical Articles (1)