CY8C24423A-24LTXI | Cypress Semiconductor

CY8C24423A-24LTXI
Status: In Production

Datasheet

(pdf, 2.08 MB) RoHS PB Free
(pdf, 1.41 MB) RoHS PB Free

CY8C24423A-24LTXI

Development KitCY3215-DK, CY3207-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs24
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.45 $2.34 $2.24 $2.14 $2.03 $1.86
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
32
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 16, 2016

Technical Documents

Application Notes (53)

Development Kits/Boards (9)

Software and Drivers (2)

Product Change Notice (PCN) (11)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 24, 2017
PSoC Product Datasheet Changes
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 17, 2017
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
Oct 17, 2017
Additional Products Qualified for 32-lead QFN (1.0 mm) Using the Saw Singulation Process at Cypress, Philippines
Oct 13, 2017
Qualification of GSMC as an alternate wafer fabrication site for the PSoC CY8C24xx3A product family
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process

Product Information Notice (PIN) (4)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757

User Module Datasheets (59)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012