CY8C24223A-24PVXIT | Cypress Semiconductor

CY8C24223A-24PVXIT
Status: In Production

Datasheet

(pdf, 2.08 MB) RoHS PB Free
(pdf, 1.41 MB) RoHS PB Free

CY8C24223A-24PVXIT

Development KitCY3215-DK, CY3208B-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs16
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.02 $1.93 $1.85 $1.76 $1.68 $1.54
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
20
Package Dimensions
288 L x 0 H x 210 W (Mils)
Package Weight
164.70 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Dec 16, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 16, 2016

Technical Documents

Application Notes (53)

Development Kits/Boards (10)

Software and Drivers (2)

Product Change Notice (PCN) (13)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 24, 2017
PSoC Product Datasheet Changes
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C24X23 Device Family.
Oct 16, 2017
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Oct 15, 2017
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Oct 13, 2017
Qualification of GSMC as an alternate wafer fabrication site for the PSoC CY8C24xx3A product family
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
Feb 10, 2016
PSoC Pb-Free Migration

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (59)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012