CY8C24123A-24SXI | Cypress Semiconductor

CY8C24123A-24SXI
Status: In Production

Datasheet

(pdf, 2.08 MB) RoHS PB Free
(pdf, 1.41 MB) RoHS PB Free

CY8C24123A-24SXI

Development KitCY3215-DK
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs6
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.49 $2.15 $2.08 $1.88 $1.70 $1.36
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 70 24-48 hours

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2425
Minimum Order Quantity (MOQ)
2425
Order Increment
2425
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 16, 2016

Technical Documents

Application Notes (53)

Development Kits/Boards (10)

Software and Drivers (2)

Product Change Notice (PCN) (18)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 24, 2017
PSoC Product Datasheet Changes
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C24X23 Device Family.
Oct 16, 2017
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
Oct 16, 2017
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 13, 2017
Qualification of GSMC as an alternate wafer fabrication site for the PSoC CY8C24xx3A product family
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
PSoC Pb-Free Migration

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (59)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012