CY8C23433-24PVXI | Cypress Semiconductor

CY8C23433-24PVXI
Status: In Production

Datasheet

(pdf, 1.36 MB) RoHS PB Free
(pdf, 746.61 KB) RoHS PB Free
(pdf, 809.85 KB) RoHS PB Free

CY8C23433-24PVXI

Development KitCY3215-DK, CY3207-Pod
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)SAR (1, 8-bit @ 375 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs26
No. of Programmable Analog Blocks4
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.00 $1.92 $1.83 $1.75 $1.67 $1.53
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 414 24-48 hours

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
235
Minimum Order Quantity (MOQ)
235
Order Increment
235
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (27)

Development Kits/Boards (1)

Jul 18, 2013

Product Change Notice (PCN) (6)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products

Product Information Notice (PIN) (2)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (56)

IBIS (1)

Jun 08, 2012