CY8C22545-24AXI | Cypress Semiconductor

CY8C22545-24AXI
Status: In Production

Datasheet

(pdf, 474.58 KB) RoHS PB Free
(pdf, 645.21 KB) RoHS PB Free
(pdf, 728.24 KB) RoHS PB Free

CY8C22545-24AXI

Development KitCY3250-22545, CY3250-22545-POD, CY3280-22x45
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Dedicated ADC (No._ Max. Resolution @ Sample Rate)SAR (1, 10-bit @ 192 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveY
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Dedicated Comparators0
No. of Dedicated I2C0
No. of Dedicated OpAmps0
No. of Dedicated SPI2
No. of Dedicated UART2
No. of GPIOs38
No. of Programmable Analog Blocks6
No. of Programmable Digital Blocks8
SRAM (KB)1
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.68 $4.90 $4.75 $4.28 $3.87 $3.10
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 345 24-48 hours

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1600
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (26)

Development Kits/Boards (1)

Jul 18, 2013

Product Change Notice (PCN) (8)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).

IBIS (1)

Jun 21, 2012