CY8C22345-24PVXAT | Cypress Semiconductor
CY8C22345-24PVXAT
| Development Kit | CY3215-DK |
| Automotive Qualified | Y |
| Boost Converter (V) | 0 |
| CPU Core | M8C |
| CapSense | Y |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | SAR (1, 10-bit @ 192 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 16 |
| LCD Direct Drive | Y |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 2 |
| No. of Dedicated UART | 2 |
| No. of GPIOs | 24 |
| No. of Programmable Analog Blocks | 6 |
| No. of Programmable Digital Blocks | 8 |
| SRAM (KB) | 1 |
| Tape & Reel | Y |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.00 | $3.84 | $3.67 | $3.50 | $3.33 | $3.05 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: May 18, 2017
IPC 1752 Material Declaration
Last Update: Oct 13, 2016
Last Update: Oct 13, 2016
Last Update: Oct 13, 2016
Last Update: Oct 13, 2016
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Technical Documents
Application Notes (26)
Aug 26, 2015
Aug 26, 2015
Development Kits/Boards (1)
Product Change Notice (PCN) (3)
Product Information Notice (PIN) (4)
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation