CY8C22345-24PVXAT | Cypress Semiconductor
CY8C22345-24PVXAT
Status: In Production
CY8C22345-24PVXAT
| Development Kit | CY3215-DK |
| Boost Converter (V) | 0 |
| CPU Core | M8C |
| CapSense | Y |
| Dedicated ADC (No._ Max. Resolution @ Sample Rate) | SAR (1, 10-bit @ 192 ksps) |
| Dedicated DAC (No._ Max. Resolution @ Sample Rate) | None |
| Flash (KB) | 16 |
| LCD Direct Drive | Y |
| Max. Operating Frequency (MHz) | 24 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.25 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Dedicated Comparators | 0 |
| No. of Dedicated I2C | 1 |
| No. of Dedicated OpAmps | 0 |
| No. of Dedicated SPI | 2 |
| No. of Dedicated UART | 2 |
| No. of GPIOs | 24 |
| No. of Programmable Analog Blocks | 6 |
| No. of Programmable Digital Blocks | 8 |
| SRAM (KB) | 1 |
| USB (Type) | None |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $4.00 | $3.84 | $3.67 | $3.50 | $3.33 | $3.05 |
| Availability | Quantity | Ships In | Order Now |
|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Check Distributors** |
Packaging/Ordering
Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
56
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Mar 15, 2016
IPC 1752 Material Declaration
Last Update: Jun 19, 2014
Last Update: Jun 19, 2014
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Last Update: Aug 07, 2015
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Technical Documents
Development Kits/Boards (1)
Product Information Notice (PIN) (4)
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation