CY8C21634-24LTXIT | Cypress Semiconductor

CY8C21634-24LTXIT
Status: In Production

Datasheet

(pdf, 1.95 MB) RoHS PB Free
(pdf, 935.22 KB) RoHS PB Free

CY8C21634-24LTXIT

Development KitCY3213A-DK
Automotive QualifiedN
Boost Converter (V)1.2
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI, UART
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO22
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
No. of GPIOs26
No. of Programmable Analog Blocks1
No. of Programmable Digital Blocks3
PWMsHW
Proximity SensingY
SRAM (KB)0.5
Sliders4
SmartSense EnabledN
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.40 $2.30 $2.20 $2.10 $2.00 $1.83
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
32
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Au, Ni/Au

Technical Documents

Application Notes (27)

Development Kits/Boards (9)

Software and Drivers (2)

Product Change Notice (PCN) (8)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 24, 2017
PSoC Product Datasheet Changes
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Oct 17, 2017
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
Oct 17, 2017
Additional Products Qualified for 32-lead QFN (1.0 mm) Using the Saw Singulation Process at Cypress, Philippines
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process

Product Information Notice (PIN) (5)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
Feb 05, 2016
Datasheet changes to CY8C21x34 Products

User Module Datasheets (42)

Programming Specifications (1)

White Papers (1)

Reference Designs (1)

IBIS (1)

Mar 04, 2014

Technical Articles (5)