CY8C21434-24LTXI | Cypress Semiconductor


Status: In Production


Development KitCY3213A-DK, CY3212-32QFN
Boost Converter (V)0
Comm. InterfaceI2C, SPI, UART
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO24
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
No. of GPIOs28
No. of Programmable Analog Blocks1
No. of Programmable Digital Blocks3
Proximity SensingY
SRAM (KB)0.5
SmartSense EnabledN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.29 $2.19 $2.10 $2.00 $1.90 $1.74
Availability Quantity Ships In Order Now
In Stock 3 904 24-48 hours


No. of Pins
Package Dimensions
196 L x 39.4 H x 196 W (Mils)
Package Weight
65.34 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA)

Last Update: Jun 28, 2012

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (9)

Software and Drivers (2)

Product Change Notice (PCN) (10)

Feb 10, 2016
Qualification of Cypress Philippines as an Additional Assembly Site for 32L Saw QFN Pb-free Package
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 32-lead QFN (1.0 mm) Products Using the Saw Singulation Process
Feb 08, 2016
Additional Products Qualified for 32-lead QFN (1.0 mm) Using the Saw Singulation Process at Cypress, Philippines
Feb 08, 2016
Qualification of ASE Shanghai as an Additional Assembly Site for Pb-Free 32-Lead QFN (1.0 mm) Products Using the Saw Singulation Process
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
Feb 05, 2016
Datasheet changes to CY8C21x34 Products
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

User Module Datasheets (42)

Programming Specifications (1)

White Papers (1)

Reference Designs (1)

IBIS (1)

Mar 04, 2014

Technical Articles (6)