CY8C21323-24LFXI | Cypress Semiconductor

CY8C21323-24LFXI

Status: Obsolete

Datasheet

(pdf, 647.4 KB) RoHS PB Free
Datasheet updated: January 25, 2016
(pdf, 732.52 KB) RoHS PB Free
Datasheet updated: January 25, 2016

CY8C21323-24LFXI

Development KitCY3215-DK
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs16
No. of Programmable Analog Blocks4
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.36 $1.30 $1.24 $1.19 $1.13 $1.04
Availability Quantity Ships In Order Now
Out of Stock 230 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
24
Package Dimensions
157 L x 1 H x 157 W (Mils)
Package Weight
43.00 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
980
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

Last Update: Jan 13, 2016

IPC 1752 Material Declaration

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Development Kits/Boards (8)

Software and Drivers (2)

Product Change Notice (PCN) (7)

Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21x23 Device Family
Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21x23 Device Family
Feb 10, 2016
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Feb 10, 2016
Shipping Label Upgrade
Feb 09, 2016
Qualification of Grace Semiconductor as an alternate wafer fabrication site for PSoC CY8C21x23 product family on SONOS4 technology
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Planned Transfer of Assembly Manufacturing from Amkor Korea 1 to Amkor Philippines 1 and ASE-KH

Advanced Product Change Notice (APCN) (2)

Feb 04, 2016
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor
Feb 04, 2016
Advance Notification - Planned Qualification and conversion from punch - type to saw -

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Top Mark Changes for CY8C21323-24LFXI and CY8C21323-24LFXIT Part Numbers

User Module Datasheets (44)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012