CY8C21234-24SXI | Cypress Semiconductor

CY8C21234-24SXI
Status: In Production

Datasheet

(pdf, 1.95 MB) RoHS PB Free
(pdf, 935.22 KB) RoHS PB Free

CY8C21234-24SXI

Development KitCY3213A-DK, CY3212-16SOIC
Automotive QualifiedN
Boost Converter (V)1.2
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI, UART
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO8
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI0
No. of Dedicated UART0
No. of GPIOs12
No. of Programmable Analog Blocks1
No. of Programmable Digital Blocks3
PWMsHW
Proximity SensingY
SRAM (KB)0.5
Sliders1
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.92 $1.84 $1.76 $1.68 $1.59 $1.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 1 440 24-48 hours

Packaging/Ordering

Package
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1680
Minimum Order Quantity (MOQ)
1680
Order Increment
1680
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (27)

Development Kits/Boards (10)

Software and Drivers (2)

Product Change Notice (PCN) (19)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 24, 2017
PSoC Product Datasheet Changes
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Advance PCN: Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Oct 16, 2017
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
Oct 16, 2017
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Oct 15, 2017
Qualification of KYEC as an Alternate Wafer Sort Site for SONOS4 Technology; CY8C21xxx Device Family
Oct 15, 2017
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21xxx Device Family
Oct 15, 2017
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21X34 Device Family.
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)

Product Information Notice (PIN) (4)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Feb 05, 2016
Datasheet changes to CY8C21x34 Products

User Module Datasheets (40)

Programming Specifications (1)

White Papers (1)

Reference Designs (1)

IBIS (1)

Mar 04, 2014

Technical Articles (6)