CY8C21123-24SXI | Cypress Semiconductor

CY8C21123-24SXI

Status: In Production

Datasheet

(pdf, 647.4 KB) RoHS PB Free
Datasheet updated: January 25, 2016
(pdf, 732.52 KB) RoHS PB Free
Datasheet updated: January 25, 2016

CY8C21123-24SXI

Development KitCY3215-DK, CY3213-8SOIC
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseN
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)4
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART1
No. of GPIOs6
No. of Programmable Analog Blocks4
No. of Programmable Digital Blocks4
SRAM (KB)0.25
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.19 $1.14 $1.09 $1.04 $0.99 $0.90
Availability Quantity Ships In Order Now
In Stock 240 24-48 hours

Packaging/Ordering

Package
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
3395
Minimum Order Quantity (MOQ)
3395
Order Increment
3395
Estimated Lead Time (days)
35
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (7)

Software and Drivers (2)

Product Change Notice (PCN) (17)

Feb 10, 2016
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; CY8C21x23 Device Family
Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, PSoC CY8C21x23 Device Family
Feb 10, 2016
Advance PCN - Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for S4 Technology
Feb 10, 2016
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
Feb 10, 2016
Shipping Label Upgrade
Feb 09, 2016
Qualification of Grace Semiconductor as an alternate wafer fabrication site for PSoC CY8C21x23 product family on SONOS4 technology
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
PSoC Product Datasheet Changes
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Grace Semiconductor

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

User Module Datasheets (42)

Programming Specifications (1)

IBIS (1)

Jun 08, 2012