CY8C20767-24FDXCT | Cypress Semiconductor

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CY8C20767-24FDXCT
Status: In Production

Datasheet

(pdf, 689.18 KB) RoHS PB Free
(pdf, 777.48 KB) RoHS PB Free

CY8C20767-24FDXCT

Development KitCY3280-20xx7
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)32
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.71
No. of CapSense Channels1
No. of CapSense IO26
No. of Dedicated Comparators2
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs28
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks0
PWMsSW
Part FamilyStandard Sync
Proximity SensingY
SRAM (KB)2
Sliders4
SmartSense EnabledN
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.82 $3.66 $3.50 $3.34 $3.18 $2.91
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
30
Package Dimensions
90 L x 0.4 H x 86 W (Mils)
Package Weight
8.00 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
3000
Minimum Order Quantity (MOQ)
3000
Order Increment
3000
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Jul 18, 2013

Product Change Notice (PCN) (3)

Feb 08, 2016
Qualification of Deca Technologies as a Test Site for all Cypress WLCSP products thereby enabling Full Turnkey WLCSP Manufacturing for these products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

IBIS (1)

Mar 04, 2014