CY8C20646A-24LTXI | Cypress Semiconductor

CY8C20646A-24LTXI
Status: In Production

Datasheet

(pdf, 1.59 MB) RoHS PB Free
(pdf, 1.05 MB) RoHS PB Free
(pdf, 1.12 MB) RoHS PB Free

CY8C20646A-24LTXI

Development KitCY3280-20X66
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI, USB
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CapSense Channels1
No. of CapSense IO33
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs36
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)2
Sliders6
SmartSense EnabledY
Tape & ReelN
USB (Type)Full-Speed

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.95 $2.82 $2.70 $2.58 $2.45 $2.25
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
48
Package Dimensions
276 L x 35 H x 276 W (Mils)
Package Weight
145.21 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
260
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (18)

Development Kits/Boards (2)

Product Change Notice (PCN) (4)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

IBIS (1)

Mar 04, 2014