CY8C20424-12LQXI | Cypress Semiconductor

CY8C20424-12LQXI
Status: In Production

Datasheet

(pdf, 3.77 MB) RoHS PB Free

CY8C20424-12LQXI

Development KitCY3203A-CAPSENSE, CY3280-BK1
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)None
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)8
LCD Direct DriveN
Max. Operating Frequency (MHz)12
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.25
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense Channels1
No. of CapSense IO25
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs25
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)0.5
Sliders1
SmartSense EnabledN
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.72 $1.64 $1.57 $1.50 $1.43 $1.31
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.24 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

Technical Documents

Product Change Notice (PCN) (8)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 20, 2017
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Oct 18, 2017
Qualification of Carsem Malaysia as an Additional Assembly Site for 32-lead QFN (5X5X0.6 mm) Package Products Using the Saw Singulation Process
Feb 08, 2016
Q1, 2009 - Q2, 2010 Horizon Report

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels