CY8C20247-24SXI | Cypress Semiconductor

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CY8C20247-24SXI
Status: In Production

Datasheet

(pdf, 689.18 KB) RoHS PB Free
(pdf, 777.48 KB) RoHS PB Free

CY8C20247-24SXI

Development KitCY3280-20xx7
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CapSense Channels1
No. of CapSense IO12
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs13
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingY
SRAM (KB)2
Sliders2
SmartSense EnabledY
Tape & ReelN
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.35 $2.25 $2.15 $2.05 $1.95 $1.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 44 24-48 hours

Packaging/Ordering

Package
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
240
Minimum Order Quantity (MOQ)
240
Order Increment
240
Estimated Lead Time (days)
105
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Development Kits/Boards (1)

Jul 18, 2013

Product Change Notice (PCN) (7)

Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 08, 2016
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Barcode Inclusion on Cypress Packing List
Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of OSE as an additional Test and Finish Location for Cypress Products

IBIS (1)

Mar 04, 2014