CY8C20246A-24LKXIT | Cypress Semiconductor

CY8C20246A-24LKXIT

Status: In Production

CY8C20246A-24LKXIT

Development KitCY3280-20X66
Automotive QualifiedN
Boost Converter (V)0
CPU CoreM8C
CapSenseY
Comm. InterfaceI2C, SPI
Dedicated ADC (No._ Max. Resolution @ Sample Rate)DelSig (1, 10-bit @ 5.9 ksps)
Dedicated DAC (No._ Max. Resolution @ Sample Rate)None
Flash (KB)16
LCD Direct DriveN
Max. Operating Frequency (MHz)24
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.71
No. of CapSense Channels1
No. of CapSense IO10
No. of Dedicated Comparators0
No. of Dedicated I2C1
No. of Dedicated OpAmps0
No. of Dedicated SPI1
No. of Dedicated UART0
No. of GPIOs13
No. of Programmable Analog Blocks0
No. of Programmable Digital Blocks0
PWMsSW
Proximity SensingN
SRAM (KB)2
Sliders2
SmartSense EnabledY
Tape & ReelY
USB (Type)None

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.10 $2.01 $1.93 $1.84 $1.75 $1.60
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Development Kits/Boards (1)

Jul 18, 2013

Product Change Notice (PCN) (5)

Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 08, 2016
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

IBIS (1)

Mar 04, 2014