CY8C20140-LDX2I | Cypress Semiconductor

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CY8C20140-LDX2I
Status: In Production

Datasheet

(pdf, 1.46 MB) RoHS PB Free
(pdf, 1.15 MB) RoHS PB Free

CY8C20140-LDX2I

Development KitCY3218-CAPEXP3
Automotive QualifiedN
CapSenseY
Comm. InterfaceI2C
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense IO4
No. of Dedicated I2C1
No. of Dedicated SPI0
No. of GPIOs4
No. of GPOs0
No. of PWM Channels0
PWMsN
Proximity SensingN
Slider SegmentsN/A
SmartSense EnabledN
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$0.96 $0.92 $0.88 $0.84 $0.80 $0.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
QFN
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
980
Minimum Order Quantity (MOQ)
980
Order Increment
980
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Application Notes (1)

Product Change Notice (PCN) (6)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products

Product Information Notice (PIN) (5)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Oct 26, 2017
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package

IBIS (1)

Mar 04, 2014