CY8C20110-LDX2I | Cypress Semiconductor

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CY8C20110-LDX2I
Status: NRND: Contact Sales

Datasheet

(pdf, 6.54 MB) RoHS PB Free
(pdf, 1.15 MB) RoHS PB Free

CY8C20110-LDX2I

Development KitCY3218-CAPEXP1
Automotive QualifiedN
CapSenseY
Comm. InterfaceI2C
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.40
No. of CapSense IO10
No. of Dedicated I2C1
No. of Dedicated SPI0
No. of GPIOs10
No. of GPOs0
No. of PWM Channels0
PWMsY
Proximity SensingN
Slider SegmentsN/A
SmartSense EnabledN
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.12 $1.07 $1.02 $0.98 $0.93 $0.85
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 45 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
16
Package Dimensions
118 L x 23 H x 118 W (Mils)
Package Weight
15.57 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Technical Reference Manuals (1)

Development Kits/Boards (1)

Jan 08, 2015

Software and Drivers (1)

Product Change Notice (PCN) (7)

Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 08, 2016
Qualification of Cypress Minnesota Inc. as an alternative wafer fabrication site and Copper Palladium as an alternative wire bond option for select PSoC Capsense Controller Product families
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Kostat Shipping Tray for Products in 16-QFN 3x3 Package
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

IBIS (1)

Mar 04, 2014