CY7C68053-56BAXIT | Cypress Semiconductor

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CY7C68053-56BAXIT
Status: In Production

Datasheet

(pdf, 1.17 MB) RoHS PB Free

CY7C68053-56BAXIT

Development KitN/A
ApplicationUSB High-Speed Peripherals
Automotive QualifiedN
CPU CoreEnhanced 8051
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16-bit Databus, DMA, GPIO, I2C, UART
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Memory ArchitectureRAM
Memory Size (KB)16
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of Endpoints7
No. of I/Os24
Software ToolsKeil S/W Tools (available from Keil)
Software ToolsKeil S/W Tools (available from Keil)
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.20 $15.71 $14.89 $12.41 $12.04 $11.21
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
56
Package Dimensions
196 L x 1 H x 196 W (Mils)
Package Weight
50.90 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Technical Reference Manuals (1)

Application Notes (18)

Development Kits/Boards (1)

Product Change Notice (PCN) (6)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Oct 18, 2017
Qualification of Advanced Interconnect Technologies (AIT) as a New Assembly Site qualified for Pb-Free 56VFBGA 5x5x1.0mm, MSL3/260C Reflow using 98.5%Sn1%Ag0.5%Cu
Oct 17, 2017
Qualification of Grace Semiconductor Manufacturing Corporation as an Alternate Wafer Fab Site; FX2LP18 CY7C68053 Device Family
Oct 12, 2017
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Planned Addition of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab Site for C8 Technology; FX2LP18 CY7C68053* Device Family.

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

Code Examples (1)

Technical Articles (1)