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CY7C68053-56BAXI | Cypress Semiconductor


Status: In Production


(pdf, 1.24 MB) RoHS PB Free
Datasheet updated: November 17, 2015


Development KitN/A
ApplicationUSB High-Speed Peripherals
CPU CoreEnhanced 8051
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16-bit Databus, DMA, GPIO, I2C, UART
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Memory ArchitectureRAM
Memory Size (KB)16
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.00
No. of I/Os24

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$18.20 $15.71 $14.89 $12.41 $12.04 $11.21
Availability Quantity Ships In Order Now
In Stock 70 24-48 hours


No. of Pins
Package Dimensions
196 L x 1 H x 196 W (Mils)
Package Weight
50.90 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

Last Update: Feb 18, 2016

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Technical Reference Manuals (1)

Development Kits/Boards (1)

Product Change Notice (PCN) (6)

Feb 10, 2016
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
Feb 09, 2016
Qualification of Grace Semiconductor Manufacturing Corporation as an Alternate Wafer Fab Site; FX2LP18 CY7C68053 Device Family
Feb 08, 2016
Qualification of Advanced Interconnect Technologies (AIT) as a New Assembly Site qualified for Pb-Free 56VFBGA 5x5x1.0mm, MSL3/260C Reflow using 98.5%Sn1%Ag0.5%Cu
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Planned Addition of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab Site for C8 Technology; FX2LP18 CY7C68053* Device Family.

Product Information Notice (PIN) (2)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation

Code Examples (1)

Technical Articles (1)