CY7C68014A-56PVXC | Cypress Semiconductor

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CY7C68014A-56PVXC
Status: In Production

Datasheet

(pdf, 787.28 KB) RoHS PB Free
(pdf, 1.69 MB) RoHS PB Free
(pdf, 5.49 MB) RoHS PB Free

CY7C68014A-56PVXC

Development KitCY3684
ApplicationUSB High-Speed Peripherals
Automotive QualifiedN
CPU CoreEnhanced 8051
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16-bit Databus, DMA, GPIO, I2C, UART
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Memory ArchitectureRAM
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints7
No. of I/Os24
Software ToolsKeil S/W Tools (available from Keil)
Software ToolsKeil S/W Tools (available from Keil)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.46 $12.55 $11.63 $11.02 $8.87 $8.26
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
56
Package Dimensions
725 L x 0 H x 295 W (Mils)
Package Weight
744.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
52
Minimum Order Quantity (MOQ)
52
Order Increment
52
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Technical Documents

Application Notes (18)

Product Change Notice (PCN) (14)

Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SSOP Packages.
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels

Code Examples (1)

Errata (1)

Reference Designs (1)

Technical Articles (1)