CY7C68013A-56BAXC | Cypress Semiconductor

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Status: In Production


(pdf, 898.01 KB) RoHS PB Free
(pdf, 948.83 KB) RoHS PB Free
(pdf, 1.01 MB) RoHS PB Free


Development KitCY3684
ApplicationUSB High-Speed Peripherals
Automotive QualifiedN
CPU CoreEnhanced 8051
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16-bit Databus, DMA, GPIO, I2C, UART
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Memory ArchitectureRAM
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints7
No. of I/Os24
Software ToolsKeil S/W Tools (available from Keil)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.36 $11.52 $10.68 $10.12 $8.15 $7.59
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 4 715 24-48 hours


No. of Pins
Package Dimensions
196 L x 1 H x 196 W (Mils)
Package Weight
50.90 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

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Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016

Technical Documents

Technical Reference Manuals (1)

Application Notes (18)

Product Change Notice (PCN) (7)

May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT) as a New Assembly Site qualified for Pb-Free 56VFBGA 5x5x1.0mm, MSL3/260C Reflow using 98.5%Sn1%Ag0.5%Cu
May 28, 2018
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
May 27, 2018
Qualification of Cypress Manufacturing Limited as an Additional Assembly Site for 56 Ball 5X5X1.0MM and 100 Ball 6X6X1.0MM VFBGA Packages
May 27, 2018
Shipping Label Upgrade
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Code Examples (1)