CY7C68013A-128AXC | Cypress
CY7C68013A-128AXC
Status: In Production
CY7C68013A-128AXC
| Development Kit | CY3684 |
| Application | USB High-Speed Peripherals |
| Automotive Qualified | N |
| CPU Core | Enhanced 8051 |
| Data Transfers | Bulk, Interrupt, Isochronous |
| I/O Options | 8/16-bit Databus, DMA, GPIO, I2C, UART |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Memory Architecture | RAM |
| Memory Size (KB) | 16 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of I/Os | 40 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $18.00 | $16.77 | $15.54 | $14.72 | $11.86 | $11.04 |
| Availability | Quantity | Ships In | Order Now |
|---|---|---|---|
| In Stock | 5 996 | 24-48 hours | Add to cart |
Packaging/Ordering
Package
No. of Pins
128
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
974.84 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
144
Minimum Order Quantity (MOQ)
144
Order Increment
144
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Package Material Declaration
Last Update: Apr 11, 2014
IPC 1752 Material Declaration
Last Update: Jul 05, 2012
Last Update: Jul 04, 2012
Last Update: Jul 04, 2012
RoHS Analysis Certificates (CoA)
RoHS Analysis Certificates (CoA) for Direct Materials
Please click here
Package Qualification Report
Technical Documents
Technical Reference Manuals (1)
Application Notes (21)
Oct 20, 2015
Aug 28, 2015
Product Change Notice (PCN) (10)
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Product Information Notice (PIN) (4)
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products