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CY7C68013A-100AXC | Cypress

CY7C68013A-100AXC

Status:

In Production

CY7C68013A-100AXC

Development KitCY3684
ApplicationUSB High-Speed Peripherals
Automotive QualifiedN
CPU CoreEnhanced 8051
Data TransfersBulk, Interrupt, Isochronous
I/O Options8/16-bit Databus, DMA, GPIO, I2C, UART
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Memory ArchitectureRAM
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of I/Os40

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.42 $16.24 $15.05 $14.26 $11.48 $10.69
Availability Quantity Ships In Order Now
In Stock 1 222 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 1.4 H x 787 W (Mils)
Package Weight
913.01 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
720
Minimum Order Quantity (MOQ)
144
Order Increment
144
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Dec 22, 2015

IPC 1752 Material Declaration

Last Update: Jul 05, 2012
Last Update: Jun 29, 2012
Last Update: Jun 29, 2012

RoHS Analysis Certificates (CoA)

Last Update: Jun 28, 2012
Last Update: Jun 28, 2012
Last Update: Jun 28, 2012

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Technical Reference Manuals (1)

Application Notes (22)

Product Change Notice (PCN) (10)

Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels

Code Examples (1)

RoHS Analysis Certificates (CoA) for Direct Materials (1)

Jul 28, 2010