CY7C68003-24LQXI | Cypress Semiconductor

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CY7C68003-24LQXI
Status: In Production

Datasheet

(pdf, 682.4 KB) RoHS PB Free

CY7C68003-24LQXI

Development KitN/A
ApplicationUSB High-Speed ULPI PHY
Automotive QualifiedN
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsULPI, 8-bit uni or bi directional
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.30
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)1.80
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$1.86 $1.61 $1.52 $1.27 $1.23 $1.15
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
24
Package Dimensions
157.5 L x 23.6 H x 157.5 W (Mils)
Package Weight
31.33 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (8)

Feb 10, 2016
Change to MoBL-USB TX3LP18 to Correct Errata
Feb 08, 2016
Final Qualification for MoBL-USB(TM) TX3LP18 USB 2.0
Feb 08, 2016
Qualification of Amkor Philippines as an Additional Assembly Site for 24-lead QFN (4X4X0.6 mm)
Feb 08, 2016
Qualification of Cypress Philippines as an Additional Assembly Site for 24-Lead Pb-Free QFN (4X4X0.6mm) Package Products Using the Saw Singulation Process
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report

Advanced Product Change Notice (APCN) (1)

Feb 04, 2016
Advance Notification - Planned Changes to MoBL-USB TX3LP18

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels