CY7C68001-56PVXC | Cypress Semiconductor

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CY7C68001-56PVXC
Status: In Production

Datasheet

(pdf, 561.08 KB) RoHS PB Free

CY7C68001-56PVXC

ApplicationUSB High-Speed Peripherals
Automotive QualifiedN
CPU CoreN/A
Data TransfersBulk, Interrupt, Isochronous, Control
I/O Options8/16-bit Databus, DMA
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Memory ArchitectureN/A
Memory Size (KB)0
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints5
No. of I/Os0
Software ToolsKeil S/W Tools (available from Keil)
Software ToolsKeil S/W Tools (available from Keil)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.03 $11.25 $10.66 $8.88 $8.62 $8.03
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
56
Package Dimensions
725 L x 0 H x 295 W (Mils)
Package Weight
744.68 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
520
Minimum Order Quantity (MOQ)
520
Order Increment
520
Estimated Lead Time (days)
56
HTS Code
8542.39.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (1)

Software and Drivers (1)

Product Change Notice (PCN) (13)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SSOP Packages.
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)

Product Information Notice (PIN) (3)

Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Code Examples (1)

Errata (1)

IBIS (1)

Jan 21, 2010