CY7C67300-100AXI | Cypress Semiconductor

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CY7C67300-100AXI
Status: In Production

Datasheet

(pdf, 2.09 MB) RoHS PB Free

CY7C67300-100AXI

Development KitCY3663
ApplicationUSB Embedded Hosts
Automotive QualifiedN
CPU CoreCY16
Data TransfersBulk, Interrupt, Isochronous
Host Ports4
I/O OptionsGPIO, HPI, HSS, SPI, I2C, UART
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Memory ArchitectureROM/RAM
Memory Size (KB)16
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.70
No. of Endpoints8
No. of I/Os32
Software ToolsGNUPro
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.13 $14.79 $14.01 $11.68 $11.33 $10.55
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 715 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
900
Minimum Order Quantity (MOQ)
450
Order Increment
450
Estimated Lead Time (days)
63
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (1)

Software and Drivers (2)

Product Change Notice (PCN) (11)

Mar 20, 2018
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (3)

Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Reference Designs (4)

Technical Articles (1)