CY7C67300-100AXI | Cypress Semiconductor

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CY7C67300-100AXI
Status: In Production

Datasheet

(pdf, 2.09 MB) RoHS PB Free

CY7C67300-100AXI

Development KitCY3663
ApplicationUSB Embedded Hosts
Automotive QualifiedN
CPU CoreCY16
Data TransfersBulk, Interrupt, Isochronous
Host Ports4
Host Ports4
I/O OptionsGPIO, HPI, HSS, SPI, I2C, UART
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Memory ArchitectureROM/RAM
Memory Size (KB)16
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.70
No. of Endpoints8
No. of I/Os32
Software ToolsGNUPro
Software ToolsGNUPro
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$17.13 $14.79 $14.01 $11.68 $11.33 $10.55
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 100 24-48 hours

Packaging/Ordering

Package
No. of Pins
100
Package Dimensions
551 L x 55 H x 551 W (Mils)
Package Weight
637.75 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
450
Minimum Order Quantity (MOQ)
450
Order Increment
450
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (1)

Software and Drivers (2)

Product Change Notice (PCN) (10)

Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels

Technical Articles (1)

Reference Designs (4)