CY7C66113C-PVXCT | Cypress Semiconductor

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CY7C66113C-PVXCT
Status: NRND: Contact Sales

Datasheet

(pdf, 1.36 MB) RoHS PB Free

CY7C66113C-PVXCT

Development KitCY3654, CY3654-P03
ApplicationUSB Full-Speed Peripherals
Automotive QualifiedN
CPU CoreM8
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsDAC Port, GPIO, HAPI, I2C, Programmable Drive
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureEPROM
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints5
No. of I/Os50
Software ToolsN/A
Software ToolsN/A
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$8.28 $7.15 $6.77 $5.64 $5.48 $5.10
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
56
Package Dimensions
725 L x 0 H x 295 W (Mils)
Package Weight
744.68 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (11)

Oct 16, 2017
Shipping Label Upgrade
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
USB MCU products availability - Supply Chain Options
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (4)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of New Carrier Tape Supplier at Cypress Philippines

Product Termination Notice (PTN) (2)

Sep 19, 2017
Aug 23, 2017