CY7C65113C-SXC | Cypress Semiconductor

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CY7C65113C-SXC
Status: NRND: Contact Sales

Datasheet

(pdf, 462.45 KB) RoHS PB Free

CY7C65113C-SXC

Development KitCY3654, CY3654-P03
ApplicationUSB Full-Speed Peripherals
Automotive QualifiedN
CPU CoreM8
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsGPIO, HAPI, I2C, Programmable Drive
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureEPROM
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints5
No. of I/Os21
Software ToolsN/A
Software ToolsN/A
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.24 $5.39 $5.10 $4.25 $4.13 $3.84
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 50 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
705 L x 0 H x 300 W (Mils)
Package Weight
830.75 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
270
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (12)

Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 13, 2017
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 08, 2016
USB MCU products availability - Supply Chain Options
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

Product Termination Notice (PTN) (2)

Sep 19, 2017
Aug 23, 2017