CY7C65113C-SXC | Cypress Semiconductor

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CY7C65113C-SXC
Status: Obsolete

Datasheet

(pdf, 462.45 KB) RoHS PB Free

CY7C65113C-SXC

Development KitCY3654, CY3654-P03
ApplicationUSB Full-Speed Peripherals
Automotive QualifiedN
CPU CoreM8
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsGPIO, HAPI, I2C, Programmable Drive
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureEPROM
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints5
No. of I/Os21
Software ToolsN/A
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.24 $5.39 $5.10 $4.25 $4.13 $3.84
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 453 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
705 L x 0 H x 300 W (Mils)
Package Weight
830.75 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
270
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (12)

May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
May 28, 2018
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
USB MCU products availability - Supply Chain Options

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (4)

Jun 14, 2018
Nov 03, 2017
Nov 03, 2017
Oct 16, 2017