CY7C64355-48LTXC | Cypress Semiconductor

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CY7C64355-48LTXC
Status: In Production

Datasheet

(pdf, 604.11 KB) RoHS PB Free
(pdf, 1.33 MB) RoHS PB Free

CY7C64355-48LTXC

Development KitCY3660
ApplicationGaming Mice, Keyboard, Joystick
Automotive QualifiedN
CPU CoreM8C
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsUSB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints8
No. of I/Os36
Software ToolsPSoC Designer
Software ToolsPSoC Designer
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.00 $3.45 $3.27 $2.73 $2.65 $2.46
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
QFN
No. of Pins
48
Package Dimensions
276 L x 35 H x 276 W (Mils)
Package Weight
145.21 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2600
Minimum Order Quantity (MOQ)
260
Order Increment
260
Estimated Lead Time (days)
77
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Technical Reference Manuals (1)

Application Notes (1)

Product Change Notice (PCN) (6)

Oct 18, 2017
Qualification of Amkor Philippines as an Additional Assembly Site for 48 QFN (7X7X1.0mm) Package
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation