You are here

CY7C64345-32LQXC | Cypress Semiconductor

CY7C64345-32LQXC

Status: In Production

Datasheet

(pdf, 1.33 MB) RoHS PB Free
Datasheet updated: November 23, 2015
(pdf, 1.18 MB) RoHS PB Free
Datasheet updated: November 23, 2015

CY7C64345-32LQXC

Development KitCY3660
ApplicationGaming Mice, Keyboard, Joystick
Automotive QualifiedN
CPU CoreM8C
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsUSB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of I/Os25
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.19 $2.75 $2.61 $2.17 $2.11 $1.96
Availability Quantity Ships In Order Now
In Stock 202 24-48 hours

Packaging/Ordering

No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
28
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Technical Reference Manuals (1)

Product Change Notice (PCN) (7)

Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Q1, 2009 - Q2, 2010 Horizon Report
Feb 08, 2016
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation