CY7C64343-32LQXC | Cypress Semiconductor

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CY7C64343-32LQXC
Status: In Production

Datasheet

(pdf, 604.11 KB) RoHS PB Free
(pdf, 1.33 MB) RoHS PB Free

CY7C64343-32LQXC

Development KitCY3660
ApplicationGaming Mice, Keyboard, Joystick
Automotive QualifiedN
CPU CoreM8C
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsUSB, GPIO, SPI, CLKIN/OUT, Vreg, ADC, I2C
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Endpoints8
No. of I/Os25
Software ToolsPSoC Designer
Software ToolsPSoC Designer
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.95 $2.55 $2.41 $2.01 $1.95 $1.82
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 75 24-48 hours

Packaging/Ordering

No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
77
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

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Technical Documents

Application Notes (1)

Product Change Notice (PCN) (4)

Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families