CY7C64215-28PVXC | Cypress Semiconductor

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Status: In Production


(pdf, 1.15 MB) RoHS PB Free


Development KitCY3664
ApplicationGaming Mice, Keyboard, Joystick
Automotive QualifiedN
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsI2C, 8-Bit UART, SPI, RF Interface
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.25
Memory ArchitectureFlash
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
No. of Endpoints4
No. of I/Os22
Software ToolsPSoC Designer
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.92 $5.11 $4.84 $4.04 $3.92 $3.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Product Change Notice (PCN) (11)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Shipping Label Upgrade
Oct 16, 2017
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; enCoReTM III CY7C64215 Device Family
Oct 15, 2017
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

User Module Datasheets (27)

Reference Designs (1)