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CY7C64215-28PVXC | Cypress Semiconductor

CY7C64215-28PVXC

Status: In Production

Datasheet

(pdf, 1.25 MB) RoHS PB Free
Datasheet updated: August 28, 2015

CY7C64215-28PVXC

Development KitCY3664
ApplicationGaming Mice, Keyboard, Joystick
Automotive QualifiedN
CPU CoreM8C
Data TransfersBulk, Interrupt, Isochronous
I/O OptionsI2C, 8-Bit UART, SPI, RF Interface
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.25
Memory ArchitectureFlash
Memory Size (KB)16
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.15
No. of I/Os22
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.86 $3.33 $3.16 $2.63 $2.55 $2.38
Availability Quantity Ships In Order Now
In Stock 2 046 24-48 hours

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1410
Minimum Order Quantity (MOQ)
1410
Order Increment
1410
Estimated Lead Time (days)
28
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Development Kits/Boards (1)

Software and Drivers (1)

Product Change Notice (PCN) (11)

Feb 10, 2016
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; enCoReTM III CY7C64215 Device Family
Feb 10, 2016
Shipping Label Upgrade
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.

User Module Datasheets (27)

Reference Designs (1)