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CY7C63823-XC | Cypress Semiconductor

CY7C63823-XC

Status: In Production

Datasheet

(pdf, 944.89 KB)
Datasheet updated: December 06, 2015

CY7C63823-XC

Development KitCY3655
ApplicationMouse
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of I/Os20
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
1
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Minimum Order Quantity (MOQ)
9000
Order Increment
9000
Estimated Lead Time (days)
21
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
5
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
N/A

Technical Documents

Product Change Notice (PCN) (4)

Feb 10, 2016
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Mar 19, 2012
Qualification of Chip Tray for Die Sales Products CYRF8935A, CY7C63823, CY7C60445 and CY7C60455