CY7C63823-XC | Cypress Semiconductor

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CY7C63823-XC
Status: In Production

Datasheet

(pdf, 860.67 KB)

CY7C63823-XC

Development KitCY3655
ApplicationMouse
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of I/Os20
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
1
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1
Minimum Order Quantity (MOQ)
9000
Order Increment
9000
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
5
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
N/A

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (4)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 10, 2016
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Mar 19, 2012
Qualification of Chip Tray for Die Sales Products CYRF8935A, CY7C63823, CY7C60445 and CY7C60455