CY7C63823-SXC | Cypress Semiconductor

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CY7C63823-SXC
Status: In Production

Datasheet

(pdf, 860.67 KB) RoHS PB Free

CY7C63823-SXC

Development KitCY3655
ApplicationMouse, Wireless Dongle
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of Endpoints3
No. of I/Os20
Software ToolsC-Compiler (CY366x)
Software ToolsC-Compiler (CY366x)
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.64 $3.15 $2.98 $2.48 $2.41 $2.24
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 150 24-48 hours

Packaging/Ordering

Package
No. of Pins
24
Package Dimensions
605 L x 0 H x 300 W (Mils)
Package Weight
658.05 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
3100
Minimum Order Quantity (MOQ)
3100
Order Increment
3100
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

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Technical Documents

Product Change Notice (PCN) (16)

Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
Oct 16, 2017
Shipping Label Upgrade
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 13, 2017
Qualification of KYOCERA KE-G3000DA as new MOLD COMPOUND for Pb-free packages built in Cypress Manufacturing Limited
Oct 13, 2017
Add Alternate Assembly Site for SOIC150mils Pb-Free
Oct 13, 2017
Add Alternate Assembly Site for SOIC300mils Pb-Free.
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.