CY7C63813-PXC | Cypress Semiconductor

You are here

CY7C63813-PXC
Status: In Production

Datasheet

(pdf, 860.67 KB) RoHS PB Free

CY7C63813-PXC

Development KitCY3655
ApplicationMouse, Wireless Dongle
Automotive QualifiedN
CPU CoreM8C
Data TransfersInterrupt
I/O OptionsUSB, PS/2, SPI, GPIO
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureFlash
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of I/Os16
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$4.04 $3.49 $3.30 $2.75 $2.67 $2.49
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
18
Package Dimensions
895 L x 0 H x 300 W (Mils)
Package Weight
1 276.44 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
345
Minimum Order Quantity (MOQ)
345
Order Increment
345
Estimated Lead Time (days)
56
HTS Code
8542.31.0001
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Nov 23, 2016

IPC 1752 Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Package Qualification Report

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (11)

Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 10, 2016
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 10, 2016
Qualification of an Alternative Assembly Site for 18L Plastic Dual In-Line (PDIP) 300 mils Pb-Free package
Feb 10, 2016
Shipping Label Upgrade
Feb 10, 2016
Qualification of Cypress Minnesota Inc. (CMI) as Second Source to SONOS4 Process, enCoRe II CY7C638XX, CY7C63310 Device Family
Feb 08, 2016
Material Change from Matte Sn to NiPdAu Leadframe Technology for Pb-Free Packages
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.