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CY7C63413C-PVXC | Cypress Semiconductor

CY7C63413C-PVXC

Status: In Production

Datasheet

CY7C63413C-PVXC

Development KitCY3654, CY3654-P02
ApplicationKeyboard
Automotive QualifiedN
CPU CoreM8B
Data TransfersInterrupt
I/O OptionsGPIO, Programmable Drive
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.50
Memory ArchitectureEPROM
Memory Size (KB)8
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of I/Os32
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.45 $4.70 $4.46 $3.71 $3.60 $3.36
Availability Quantity Ships In Order Now
In Stock 280 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
625 L x 2.3 H x 295 W (Mils)
Package Weight
650.23 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
21
HTS Code
8542.31.0000
ECCN
(A.3)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (13)

Feb 10, 2016
Qualification of KYOCERA Green Mold Compound for Small Shrink Outline Packages (SSOP) assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of 7C63411BU (USB2) Device at MagnaChip on P26 Technology
Feb 08, 2016
USB MCU products availability - Supply Chain Options
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (3)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels