CY7C63101C-QXC | Cypress Semiconductor

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CY7C63101C-QXC
Status: Obsolete

CY7C63101C-QXC

Development KitCY3650
ApplicationMouse
Automotive QualifiedN
CPU CoreM8A
Data TransfersInterrupt
I/O OptionsDAC Port, GPIO, Programmable Drive
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)5.25
Memory ArchitectureEPROM
Memory Size (KB)4
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)4.00
No. of I/Os16
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.09 $2.67 $2.53 $2.11 $2.04 $1.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
24
Package Dimensions
340 L x 1 H x 150 W (Mils)
Package Weight
142.49 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
275
Minimum Order Quantity (MOQ)
275
Order Increment
275
Estimated Lead Time (days)
105
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

Technical Documents

Product Change Notice (PCN) (7)

Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 16, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)

Product Information Notice (PIN) (1)

Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement

Product Termination Notice (PTN) (1)

Oct 26, 2017
February 2010 Product Obsolescence Notification