CY7C60445-32LQXC | Cypress Semiconductor

CY7C60445-32LQXC
Status: NRND: Contact Sales

Datasheet

(pdf, 634.2 KB) RoHS PB Free

CY7C60445-32LQXC

Development KitCY3660
ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
CPU CoreM8C
Code Memory ArchitectureFlash
Code Memory Size (KB)16
I/O OptionsGPIO, I2C, SPI, ADC
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)24
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)1.71
No. of I/Os28
RAM Size (Bytes)1024
Software ToolsY
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.67 $2.31 $2.19 $1.82 $1.77 $1.65
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

No. of Pins
32
Package Dimensions
196 L x 0.6 H x 196 W (Mils)
Package Weight
43.44 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
490
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
77
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Technical Reference Manuals (1)

Application Notes (7)

Development Kits/Boards (1)

Product Change Notice (PCN) (7)

Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Quad Flat No-Lead (QFN) Products
Oct 23, 2017
Qualification of ASE Taiwan as an additional assembly site for all Quad Flat No-Lead (QFN) packaged products
Oct 20, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 20, 2017
Qualification of Cypress Philippines as an Additional Assembly Site for 32-Lead QFN (5x5x0.6 mm) Package Products Using the Saw Singulation Process
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Q1, 2009 - Q2, 2010 Horizon Report

Product Information Notice (PIN) (3)

Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Termination Notice (PTN) (2)

Nov 03, 2017
Oct 16, 2017