CY7C60223-SXC | Cypress Semiconductor

CY7C60223-SXC
Status: Obsolete

Datasheet

(pdf, 1.36 MB) RoHS PB Free

CY7C60223-SXC

ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
CPU CoreM8C
Code Memory ArchitectureFlash
Code Memory Size (KB)8
I/O OptionsGPIO, SPI
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)12
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)2.70
No. of I/Os20
RAM Size (Bytes)256
Software ToolsY
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.71 $2.34 $2.22 $1.85 $1.79 $1.67
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
24
Package Dimensions
605 L x 0 H x 300 W (Mils)
Package Weight
658.05 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1550
Minimum Order Quantity (MOQ)
1550
Order Increment
1550
Estimated Lead Time (days)
42
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (6)

Product Change Notice (PCN) (13)

Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select SOIC products
Oct 18, 2017
Datasheet changes to enCoRe(TM) II Low Voltage Products
Oct 17, 2017
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 13, 2017
Change in Tube Bundling Ship Process
Oct 13, 2017
Add Alternate Assembly Site for SOIC300mils Pb-Free.
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 18, 20 and 24 lead 300 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family

Product Information Notice (PIN) (3)

Nov 07, 2017
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels