CY7C60223-QXC | Cypress Semiconductor

CY7C60223-QXC

Status: Obsolete

Datasheet

(pdf, 1.43 MB) RoHS PB Free
Datasheet updated: August 31, 2015

CY7C60223-QXC

ApplicationWireless Mouse, Remote Control, Presenter Tool, Medical Devices, Gaming Controllers, Other General Purpose Wireless Applications
Automotive QualifiedN
CPU CoreM8C
Code Memory ArchitectureFlash
Code Memory Size (KB)8
I/O OptionsGPIO, SPI
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Max. Speed (MHz)12
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)2.70
No. of I/Os20
RAM Size (Bytes)256
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$2.57 $2.22 $2.11 $1.76 $1.70 $1.59
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
24
Package Dimensions
340 L x 1 H x 150 W (Mils)
Package Weight
142.49 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1925
Minimum Order Quantity (MOQ)
1925
Order Increment
1925
Estimated Lead Time (days)
42
HTS Code
8542.31.0000
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Product Change Notice (PCN) (14)

Feb 10, 2016
Qualification of Grace Semiconductor as an Additional Wafer Foundry site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
Feb 10, 2016
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of Grace Semiconductor as an Alternate Wafer Foundry Site for SONOS4 Technology; USB5CR (enCoReTM II) CY7C60*, CY7C633*, & CY7C638* Device Family
Feb 10, 2016
Change in Tube Bundling Ship Process
Feb 10, 2016
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Feb 10, 2016
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads QSOP package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Feb 08, 2016
Datasheet changes to enCoRe(TM) II Low Voltage Products
Feb 08, 2016
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.