CY7C53120E4-40AXI | Cypress Semiconductor

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CY7C53120E4-40AXI
Status: In Production

Datasheet

(pdf, 539.48 KB) RoHS PB Free

CY7C53120E4-40AXI

Automotive QualifiedN
Flash (KB)4
Max. Input Clock (MHz)40
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)5.00
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)5.00
ROM (KB)12
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$10.30 $9.86 $9.43 $9.00 $8.57 $7.85
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
44
Package Dimensions
395 L x 1.4 H x 395 W (Mils)
Package Weight
285.67 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
160
Minimum Order Quantity (MOQ)
160
Order Increment
160
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Package Material Declaration

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: May 15, 2013

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (13)

Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Aug 31, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 08, 2016
Qualification of Cypress Minnesota as Alternate Wafer Fabrication Facility for Neuron® Chip Network Processor Products
Feb 08, 2016
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
Feb 08, 2016
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Feb 08, 2016
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Feb 08, 2016
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Advanced Product Change Notice (APCN) (2)

Feb 04, 2016
Advance Notification - Transfer of Specific Product Manufactured by Cypress Semiconductor Texas to Cypress Manufacturing Minnesota
Feb 04, 2016
Advance Notification - Planned Changes to MoBL-USB TX3LP18

Product Information Notice (PIN) (5)

Feb 05, 2016
Qualification of Kyocera Green Mold Compound: Information-Only Announcement
Feb 05, 2016
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Feb 05, 2016
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Feb 05, 2016
Changes to Cypress Address Labels
Feb 05, 2016
Qualification of Test 25 (Austin, Texas) as an Additional Wafer-Level Test Location.