CY7C4225-15AXC | Cypress Semiconductor

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CY7C4225-15AXC
Status: Obsolete

CY7C4225-15AXC

Automotive QualifiedN
Density (Kb)16
Frequency (MHz)67
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)4.50
Min. Operating Voltage (V)4.50
Organization (X x Y)1Kb x 18
Speed (ns)0
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$22.40 $18.48 $17.14 $15.68 $15.01 $14.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
64
Package Dimensions
551 L x 1.4 H x 551 W (Mils)
Package Weight
637.91 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
90
Minimum Order Quantity (MOQ)
90
Order Increment
90
Estimated Lead Time (days)
42
HTS Code
8542.32.0071
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Material Declaration

Last Update: Dec 15, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Technical Documents

Application Notes (1)

Product Change Notice (PCN) (8)

Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 24, 2017
Qualification of ASE Taiwan as an additional assembly site for 64-pin and 44-pin Thin Quad Flat Package (TQFP) products
Oct 16, 2017
Shipping Label Upgrade
Oct 15, 2017
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44/64/100/128 lead Pb-free TQFP packages assembled at Cypress Manufacturing Limited (CML)
Oct 12, 2017
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 12, 2017
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML

Product Information Notice (PIN) (3)

Nov 06, 2017
Changes to Cypress Address Labels
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Oct 25, 2017
Qualification of Kyocera Green Mold Compound: Information-Only Announcement