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CY7C1568KV18-400BZXC | Cypress Semiconductor


Status: In Production


ArchitectureDDR-II+ CIO
Burst Length (Words)2
Density (Kb)73728
Density (Mb)72
Frequency (MHz)400
Max. Operating Temp. (°C)70
Max. Operating VCCQ (V)1.90
Max. Operating Voltage (V)1.90
Min. Operating Temp. (°C)0
Min. Operating VCCQ (V)1.40
Min. Operating Voltage (V)1.70
Organization (X x Y)4Mb x 18
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$204.00 $178.50 $174.68 $170.85 $167.03 $163.20
Availability Quantity Ships In Order Now
Out of Stock 0 Please click here to check lead times


No. of Pins
Package Dimensions
591 L x 1.4 H x 512 W (Mils)
Package Weight
499.56 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish

Package Material Declaration

IPC 1752 Material Declaration

Last Update: Oct 07, 2016

RoHS Analysis Certificates (CoA) for Direct Materials

Please click here

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (8)

Feb 08, 2016
Qualification of JEDEC Shipping Tray for Sync and QDR SRAM products in 165 FBGA package
Feb 08, 2016
Qualification of ASE Taiwan as an additional assembly site for 165 Ball Grid Array (BGA) packaged products
Feb 08, 2016
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products
Feb 08, 2016
Qualification of 65nm products without Nitride Seal Mask (NSM)
Feb 07, 2016
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Feb 07, 2016
Qualificationof Cypress Bangkok as an additional Assembly Site for Select 165 Ball Grid Array(BGA) Products
Feb 07, 2016
Q1, 2012 - Q2, 2013 Horizon Report
Oct 04, 2012
Q2, 2012 - Q4, 2013 Horizon Report

Product Information Notice (PIN) (1)

Feb 05, 2016
Changes to Cypress Address Labels

BSDL (1)

Jan 20, 2012

Verilog (1)

Jan 18, 2012

IBIS (1)

Jan 18, 2012